- Presentation from Jia Ning on the OCP modularization initiative.
- Aim to get module information disseminated across OCP - as an example ODSA PoC leveraging
OCP NIC 3.0
- Great presentation from Eelco Bergman of ASE on packaging and working with the ODSA
- Comprehensive overview of the different types of multi-device packaging options and trade-offs.
Well worth your time.
- Call to Action: Virtual prototyping of PoC for packaging using BoW footprint standardization in the CDX group
- OCP virtual summit plans
- Lightning talk lineup confirmed
- Aiming to record our two panels on GTM with a live audience (please show up!)
- We will try to use our Friday slots.